I-Round Hole IC isokhethi Isixhumi DIP 6 8 14 16 18 20 24 28 40 pin Amasokhethi DIP6 DIP8 DIP14 DIP16 DIP18 DIP20 DIP28 DIP40 amaphini
Ezogesi
Ukusebenza kukagesi
Ukumelana Nokuxhumana: 30mΩmax.DC100mA
Ukumelana nokuxhumana: 30mΩ max.DC100mA
I-Insulator Resistance: 1000MΩmin.atDC500v
Ukumelana ne-insulation: 1000MΩmin.atDC500v
Ukumelana ne-voltage: AC500V/1Min
Ukumelana ne-voltage: AC500V/1Min
Isilinganiso samanje: 1AMP
Ikalwe okwamanje: 1AMP
Okubalulekile
Material kanye Plating
Ezezindlu: PBT&20%Glass Fiber
Izingxenye zepulasitiki: PBT&20%I-Glass Fiber
Othintana naye: Ithusi le-Phosphor
Izinto zokuxhumana: ithusi le-phosphor
Amasokhethi e-IC kuzinhlelo zokusebenza
Kumakhompuyutha e-notebook nawedeskithophu, amasokhethi ethu e-LGA afaka ipuleti le-bolster eliqinile ukuze lixhumeke okuthembekile kuphakheji ye-microprocessor ngenkathi ikhawulela ukukhothama kwe-PCB ngesikhathi sokucindezelwa.Kumaseva, amasokhethi ethu e-mPGA kanye ne-PGA -- anamalungu afanayo ngokwezifiso atholakala ezindaweni ezingaphezu kuka-1,000 -- anikeza isixhumi esibonakalayo samandla okufaka iqanda kuphakeji ye-PGA ye-microprocessor futhi inamathisele ku-PCB enobuchwepheshe bokunamathisela obuphezulu.Amasokhethi e-TE's IC akhelwe ukusebenza okuphezulu kwama-CPU processors.
Amasokhethi Esifunda Ahlanganisiwe
Kumakhompuyutha e-notebook nawedeskithophu, amasokhethi ethu e-LGA afaka ipuleti le-bolster eliqinile ukuze lixhumeke okuthembekile kuphakheji ye-microprocessor ngenkathi ikhawulela ukukhothama kwe-PCB ngesikhathi sokucindezelwa.Kumaseva, amasokhethi wethu we-mPGA kanye ne-PGA -- anamalungu afanayo ngokwezifiso atholakala ezindaweni ezingaphezu kuka-1,000 --nikeza isixhumi esibonakalayo se-zero insertion force (ZIF) kuphakheji ye-PGA ye-microprocessor futhi inamathisele ku-PCB nge-soldering ye-surface-mount technology (SMT).Amasokhethi e-TE's IC akhelwe ukusebenza okuphezulu kwama-CPU processors.
Inombolo Yengxenye | Isixhumi se-IC Socket | Iphimbo | 2.54mm |
Xhumana Nokumelana | 20mΩ Max | Amandla kagesi | I-AC 500V/Iminithi |
I-insulator | I-Thermoplastic UL94V-0 | Izinto Zokuthintana | Ingxubevange yethusi |
Izinga Lokushisa | -40° ~ +105° | Izikhundla | 6-42 |
Umbala | Mnyama/OEM | Uhlobo Lokukhweza | I-DIP |
Isikhathi senani | EXW | I-MOQ | 50 Izingcezu |
Isikhathi esiholayo | 7-10 Izinsuku Zebhizinisi | Isikhathi Sokukhokha | T/T, Paypal, Western Union |
Lezi zixhumi zenzelwe ukuhlinzeka ngoxhumano olucindezelayo phakathi komkhondo wengxenye kanye nebhodi lesekethe eliphrintiwe (PCB).Amasokhethi wethu wesekethe edidiyelwe (IC) aklanyelwe ukuhlinzeka ngoxhumano olucindezelayo phakathi komkhondo wengxenye ne-PCB.Amasokhethi ethu e-IC akhiwe ukuze asize ukwenza umklamo webhodi ube lula, unike amandla ukuhlela kabusha okulula nokunwetshwa nokukhanda kalula nokushintshwa.Umklamo unikeza isisombululo esingabizi kakhulu ngaphandle kwengozi ye-solder eqondile.